JPH043499Y2 - - Google Patents
Info
- Publication number
- JPH043499Y2 JPH043499Y2 JP7415486U JP7415486U JPH043499Y2 JP H043499 Y2 JPH043499 Y2 JP H043499Y2 JP 7415486 U JP7415486 U JP 7415486U JP 7415486 U JP7415486 U JP 7415486U JP H043499 Y2 JPH043499 Y2 JP H043499Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- semiconductor element
- lid
- glass layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 44
- 239000004065 semiconductor Substances 0.000 claims description 44
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 5
- 230000006866 deterioration Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000005394 sealing glass Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7415486U JPH043499Y2 (en]) | 1986-05-16 | 1986-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7415486U JPH043499Y2 (en]) | 1986-05-16 | 1986-05-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62186433U JPS62186433U (en]) | 1987-11-27 |
| JPH043499Y2 true JPH043499Y2 (en]) | 1992-02-04 |
Family
ID=30919115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7415486U Expired JPH043499Y2 (en]) | 1986-05-16 | 1986-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043499Y2 (en]) |
-
1986
- 1986-05-16 JP JP7415486U patent/JPH043499Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62186433U (en]) | 1987-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH043499Y2 (en]) | ||
| JPH0625965Y2 (ja) | ガラス封止形半導体素子収納用パッケージ | |
| JP3176267B2 (ja) | 半導体素子収納用パッケージ | |
| JP2515659Y2 (ja) | 半導体素子収納用パッケージ | |
| JPS634350B2 (en]) | ||
| JP2740604B2 (ja) | 半導体装置 | |
| JP2691306B2 (ja) | 半導体素子収納用パッケージ | |
| JP3318449B2 (ja) | 半導体素子収納用パッケージ | |
| JP2736451B2 (ja) | 半導体素子収納用パッケージ | |
| JP2922719B2 (ja) | 半導体素子収納用パッケージ | |
| JPH05326738A (ja) | 半導体素子収納用パッケージ | |
| JP3359536B2 (ja) | 電子部品収納用容器 | |
| JP2538845Y2 (ja) | 半導体素子収納用パッケージ | |
| JPH0629330A (ja) | 半導体装置 | |
| JPH043666B2 (en]) | ||
| JP2691312B2 (ja) | 半導体素子収納用パッケージ | |
| JPS6231498B2 (en]) | ||
| JP2548964Y2 (ja) | 半導体素子収納用パッケージ | |
| JPH0613481A (ja) | 電子部品収納用パッケージ | |
| JP2851740B2 (ja) | 電子部品収納用パッケージ | |
| JP2518721Y2 (ja) | 半導体素子収納用パッケージ | |
| JP2759300B2 (ja) | ガラス封止型半導体素子収納用パッケージ | |
| JP3292609B2 (ja) | 半導体素子収納用パッケージ | |
| JP2750256B2 (ja) | 半導体素子収納用パッケージ | |
| JP4873980B2 (ja) | 気密パッケージ |